2024

Communications dans un congrès

Alauzet Louis, Patrick Tounsi, Fradin Jean-Pierre. Sensorless Dual TSEP Implementation for Junction Temperature Measurement in Parallelized SiC Mosfets. 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2024), Sep 2024, Toulouse, France. pp.1-4, ⟨10.1109/THERMINIC62015.2024.10732557⟩. ⟨hal-04809031⟩

Louis Alauzet, Jean-Pierre Fradin, Alexandre Dezalay, Anne Castelan, Patrick Tounsi, et al.. Innovative 3D Power Module Defaults Detection via Thermal Impedance Analysis and Simulations. PCIM Europe 2024 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Jun 2024, Nuremberg, Germany. ⟨hal-04810047⟩

2020

Communications dans un congrès

Anaïs Cassou, Quang Chuc Nguyen, Patrick Tounsi, Jean-Pierre Fradin, Marc Budinger, et al.. Extraction of compact transient thermal models for a global optimization of a power system based on SiC MOSFETs switches. 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2020), Sep 2020, Berlin, Germany. ⟨hal-03655834⟩

Quang Chuc Nguyen, Patrick Tounsi, Jean-Pierre Fradin, Jean-Michel Reynes. Investigation on the use of the MOSFET SiC body diode for junction temperature measurement. IEEE THERMINIC 2020, Fraunhofer Berlin, Sep 2020, Berlin, Germany. ⟨hal-03655865⟩

2019

Communications dans un congrès

Anais Cassou, Patrick Tounsi, Jean-Pierre Fradin. Using Compact Thermal Modelling for the investigation of a cooling system dysfunction applied to a power module with double sided cooling. MIXDES 2019, Jun 2019, Rzeszow, Poland. ⟨10.23919/MIXDES.2019.8787192⟩. ⟨hal-02613604⟩

Nguyen Quang, Patrick Tounsi, Jean-Pierre Fradin, Jean-Michel Reynes. Development of SiC MOSFET Electrical Model and Experimental Validation: Improvement and Reduction of Parameter Number. 26th International Conference "Mixed Design of Integrated Circuits and Systems" (MIXDES 2019), Jun 2019, Rzeszów, Poland. pp.298 - 301, ⟨10.23919/MIXDES.2019.8787050⟩. ⟨hal-02613777⟩

Quang Nguyen, Patrick Tounsi, Jean-Pierre Fradin, Jean-Michel Reynes. Development of SiC MOSFET electrical model and experimental validation: improvement and reduction of parameter number. 26th International Conference "Mixed Design of Integrated Circuits and Systems MIXDES 2019, Lodz University of Technology Department of Microelectronics and Computer Science, Jun 2019, Rzeszów, Poland. ⟨hal-03655841⟩

Nabil El Belghiti Alaoui, Patrick Tounsi, Alexandre Boyer, Arnaud Viard. Detecting PCB Assembly defects using infrared thermal signatures. 27th International Conference Mixed Design of Integrated Circuits and Systems (MIXDES2019), Jun 2019, Wroclaw, Poland. ⟨10.23919/MIXDES.2019.8787089⟩. ⟨hal-02319460⟩

Quang Nguyen, Patrick Tounsi, Jean-Pierre Fradin, Jean-Michel Reynes. Investigation of SiC MOSFET channel reverse conduction. 13th International Conference on Power Electronics and Drive Systems (PEDS 2019), Jul 2019, Toulouse, France. ⟨10.1109/PEDS44367.2019.8998901⟩. ⟨hal-02613785⟩

M A González-Sentís, Patrick Tounsi, A. Bensoussan, A. Dufour. Degradation indicators of power-GaN-HEMT under switching power-cycling. ESREF 2019, Sep 2019, Toulouse, France. ⟨10.1016/j.microrel.2019.113412⟩. ⟨hal-02613682⟩

Nabil El Belghiti Alaoui, Anais Cassou, Patrick Tounsi, Alexandre Boyer, Arnaud Viard. Using infrared thermal responses for PCBA production tests: Feasibility study. 30 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2019), Sep 2019, Toulouse, France. ⟨hal-02319468⟩

Sébastien Sanchez, Cong Tu Nguyen, Claudia Cadile, Jean-Pierre Fradin, Patrick Tounsi, et al.. Electrothermal Characterization of Double-Sided Cooling Si Power Module. ELECTRIMACS 2019, May 2019, Salerno, Italy. ⟨10.1007/978-3-030-37161-6_5⟩. ⟨hal-02613793⟩

2018

Articles dans une revue

Nabil El Belghiti Alaoui, Alexandre Boyer, Patrick Tounsi, A. Viard. New defect detection approach using near electromagnetic field probing of high density PCBAs. Microelectronics Reliability, 2018, 88-90, pp.288-293. ⟨10.1016/j.microrel.2018.07.090⟩. ⟨hal-01885517⟩

Nabil El Belghiti Alaoui, Alexandre Boyer, Patrick Tounsi, Arnaud Viard. Upgrading In-Circuit Test of high density PCBAs using electromagnetic measurement and Principal Component Analysis. Journal of Electronic Testing: : Theory and Applications, 2018, 34 (6), pp.749-762. ⟨10.1007/s10836-018-5763-4⟩. ⟨hal-01944924⟩

Communications dans un congrès

Manuel A González-Sentís, Patrick Tounsi, Alain Bensoussan, Arnaud Dufour. Drift effects and trap analysis of power-GaN-HEMT under switching power cycling. Science of Electronics, Technologies of Information and Telecommunication, SETIT’18, Dec 2018, Hammamet, Tunisia. ⟨hal-02131990⟩

Nabil El-Belghiti, Patrick Tounsi, Alexandre Boyer, Arnaud Viard. New testing approach using near electromagnetic field probing intending to upgrade in-circuit testing of high density PCBAs. 27th IEEE North Atlantic Test Workshop, May 2018, Essex, United States. ⟨10.1109/NATW.2018.8388867⟩. ⟨hal-01997428⟩

Anais Cassou, Patrick Tounsi, Jean-Pierre Fradin. Compact thermal modelling for fast simulating consequences of pump defect: application to power module with double efficient cooling. THERMINIC 2018, Sep 2018, Stockholm, Sweden. pp.1-5, ⟨10.1109/THERMINIC.2018.8593317⟩. ⟨hal-02613655⟩

Nabil El Belghiti Alaoui, Patrick Tounsi, Alexandre Boyer, Arnaud Viard. New defect detection approach using near electromagnetic field probing for high density PCBAs New defect detection approach using near electromagnetic field probing of high density PCBAs. 29 th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2018), Oct 2018, Aalborg, Denmark. ⟨10.1016/j.microrel.2018.07.090⟩. ⟨hal-02319457⟩