Electromagnetic Compatibility (EMC)
ESE team studies the problems related with electromagnetic parastic emission and radiofrequency interference at integrated circuit and printed circuit board level, with the development of original characterization and modeling methods for a deep analysis and a better prediction of EMC issues.
In a context of stringent constraints in term of Electromagnetic Compatibility (EMC) compliance, EMC is a major source of cost and delay for electronic device and equipment manufacturer if this issue is not considered efficiently during design stage. This situation is extremely critical for safety-critical applications (e.g. aerospace, e-Health, automotive)
Predicting, diagnosing and solving EMC issues require specific charcaterization tools, but also dedicated modeling and simulation methods.
The EMC-related activities of EMC team concern mainly the integrated-circuit and the printed-circuit board level. The covered research topics are:
- EMC characterization methods for circuits and printed circuit board (e.g. based on near-field, multitone injection, TLP)
- Modeling and macromodeling for EMC simulation at circuit/PCB/equipment level
- Improvement of EMC-oriented design rules
- Integration of the impact of environment on EMC
