Technical staff

Laurent MAZENQ (AI - Area responsible) 

Photolithography is to reproduce an image on a coated substrate with a layer of photosensitive material (photoresist). This layer undergoes a chemical transformation under the effect of ultra violet radiation; the irradiated area will see its solubility increase or decrease depending on the type of resist (+ or-). This phase is the revelation. The part of the substrate stripped may then suffer various treatments: etching, deposition, settlements of ions...



The area is free service.

Any person wishing to work must undergo training on equipment after having signed the “Charte of the user of the Photolithography and chemistry areas".

The Photolithography area is composed of 32 equipment on an area of 90 m2 class 100. 
It includes 2 independent parties, a manual and an automated:

  • Manual part within an HMDS oven, 3  Gyrset spin coaters and various annealing systems (ovens, hot plates), 3 masks aligners including 2 double-sided equipments dedicated to not exceeding 4 "diameter  substrates.
  • Automatic part, within an HMDS oven, a system for coating and development of resists (EVG 120), a double-side mask aligner with automatic alignment (EVG 620), a semi automatic (Suss Microtec MA 150) mask aligner, dedicated to 4” and 6” diameter substrates.





Resist benches 



Equiped with a total of 2 SUSS MICROTEC hot plates with ascent and descent ramp and 6 Micro Systems Ltd hot plates




Spin coating 
4 spin coaters; 3 Gyrset et 1 classicla




2 mask aligners MJB32 (right)



1 mask aligner MA6




Ovens (on the left) 
1  HMDS 
2 drying 100°C et 200°C 
1 with hygrometric control 




Automated equipments

Enduction/development tracks


EVG 620 Mask aligner 



MA 150 Mask aligner  




Projection lithography 
Canon 3000i4



CO2 supercritical drying







Know how

The main photosensitive materials used are:

  • Positive  Clariant (AZ 1505, AZ1529, AZ4562, ECL 3012),
  •  Clariant lift off (AZ 5214); AZ N lof2035),
  • Shipley (RPD 220) for thicknesses ranging from 0.5µm to 20µm. 
  • Negative resists Microchem (SU8 3005, 3025, 3050, 2075) for thicknesses ranging from 1µm to 500µm; 
  • A photosensitive polyimide Dow Chemical (BCB) for thicknesses of 2.5µm and µm.


SU8 - 0,5µm


SU8 - 25µm



SU8 - 50µm



SU8 - 100µm



SU8 - 500µm



Lift off NLOF 5µm 



ECI 1.2µm for by lithoprojection



AZ 40XT 20µm