Packaging

Technical staff

Monique DILHAN (IR - Area responsible)
Samuel CHARLOT (IE)
David COLIN (AI)
Séverine VIVIES (AI)
David JUGIEU (IR)

Assembly steps occur at the end of the manufacturing process. When the components must be tested or used individually. The typical "chain" of components assembly breaks down as follows:

  • mapping
  • discretization (cutting)
  • mounting on support (glue, solder, eutectic, flip chip, etc.) 
  • Electricalc onnection (wire bonding, flip-chip, screen printing)
  • Protection (encapsulation, sealing)

 You can also realize collective treatment of samples, such as the chemical mechanical polishing, thinning and substrates bonding such as thermocompression, Anodic bonding etc...

Equipments

 

Wire bonding 
3 equipments

 

 

 

Eutectic 
1 equipment 

 

 

 

Pick and place 
2 equipments 

 

 

 

Flip chip 
1 equipment 

 

 

 

Grinder 
1 équipment 

 

 

Wafer bonder 
2 équipments 

 

 

Scribbing 
2 équipments 

 

 

 

Chemical machanical polishing 
1 equipment

 

 

 

 

Dicing saw 
1 equipment

 

 

 

 

Chemical mechanical polishing 
1 equipment 

 

 

 

 

Screen printing 
1 equipment

 

 

 

Know How

All stages of the Assembly process are achievable with for many of them  various techniques. 

  • Cutting diamond saw (scribber)
  • Mounting (eutectic , manual report, semi automated, flip chip, choice of adhesives, etc.) 
  • Electrical connection (Wedge, ball, Ribbon with different diameters of wires, screen printing)
  • Chemical mechanical thinning
  • Substrate bonding(Anodic, direct, eutectic)