125documents trouvés
Influence des contraintes mécaniques et thermomécaniques sur les caractéristiques électriques d'un transistor VDMOS
E.MARCAULT, A.BOURENNANE, M.BREIL, P.TOUNSI, J.M.DORKEL
ISGE
Manifestation avec acte : Journées Nationales du Réseau Doctoral en Microélectronique (JNRDM 2010), Montpellier (France), 7-9 Juin 2010, 5p. , N° 10533
Diffusable
122475A temperature-dependent power MOSFET model for switching application
H.DIA, J.B.SAUVEPLANE, P.TOUNSI, J.M.DORKEL
ISGE
Manifestation avec acte : THERMINIC 2009, Louvain (Belgique), 7-9 Octobre 2009, pp.87-90 , N° 09861
Diffusable
120342Potentialities of silicon piezoresistivity for mechanical state monitoring of VDMOS transistors
E.MARCAULT, M.BREIL, P.TOUNSI, J.M.DORKEL, A.BOURENNANE, J.B.SAUVEPLANE
ISGE
Manifestation avec acte : MIXDES 2009, Lodz (Pologne), 25-27 Juin 2009, 5p. , N° 09167
Diffusable
117983Adaptive multiple cooling surfaces compact thermal model (CTM) and boundary condition independent multiple heat sources CTM
P.TOUNSI, J.B.SAUVEPLANE, J.NOWAKOWSKI, F.MADRID-LOZANO, J.M.DORKEL
ISGE
Rapport LAAS N°09330, Juin 2009, 7p.
Diffusable
117994Electro-thermal co-simulation with REBECA-3D
H.FERAL, J.P.FRADIN, P.TOUNSI, J.M.DORKEL, J.B.SAUVEPLANE
EPSILON, ISGE
Manifestation avec acte : 3rd International Conference on Automotive Power Electronics, Paris (France), 25-26 Mars 2009, 3p. , N° 09361
Diffusable
118142New methodologies for extraction of dynamic compact thermal models
W.HABRA, P.TOUNSI, F.MADRID-LOZANO, P.DUPUY, J.M.DORKEL
ISGE, FREESCALE
Rapport LAAS N°08308, Juin 2008, 31p.
Diffusable
114175New method of dynamic compact thermal model extraction
W.HABRA, P.TOUNSI, F.MADRID-LOZANO, J.M.DORKEL
ISGE
Manifestation avec acte : 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2008), Freiburg-im-Breisgau (Allemagne), 21-23 Avril 2008, pp.88-91 , N° 08136
Diffusable
Plus d'informations
Abstract
A Compact Thermal Model extraction method for multi-chip power electronics systems is proposed. Innovative and accurate, it accounts for dynamic thermal coupling between multiple heat sources. The use of this model permits system designers to easily take into account transient electro-thermal coupling. The method is based on a definition of the Optimal Thermal Coupling Point, which is proven to be suitable even under transient conditions. Compared to the existing methods, the number of needed 3D thermal simulations or measurements for the model deduction is significantly reduced.
A new methodology for extraction of dynamic compact thermal models
W.HABRA, P.TOUNSI, F.MADRID-LOZANO, P.DUPUY, C.BARBOT, J.M.DORKEL
ISGE, FREESCALE
Manifestation avec acte : 13th International Workshop on THERMal INvestigations of ICs and Systems (THERMINICS 2007), Budapest (Hongrie), 17-19 Septembre 2007, pp.141-144 , N° 07465
Lien : http://hal.archives-ouvertes.fr/hal-00202550/fr/
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Plus d'informations
Abstract
An innovative and accurate dynamic Compact Thermal Model extraction method is proposed for multi-chip power electronics systems. It accounts for thermal coupling between multiple heat sources. Transient electro-thermal coupling can easily be taken into account by system designers. The method is based on a definition of the Optimal Thermal Coupling Point, which is proven to be valid even for transient modelling. Compared to the existing methods, the number of needed 3D thermal simulations or measurements is significantly reduced.
New electro-thermal modeling tools for automotive power circuits design optimization
W.HABRA, P.TOUNSI, P.DUPUY, J.M.DORKEL, F.MADRID-LOZANO
ISGE, FREESCALE
Manifestation avec acte : IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM 2007), Boston (USA), 30 Septembre - 2 Octobre 2007, pp.86-89 , N° 07464
Diffusable
Plus d'informations
Mots-Clés / Keywords
Compact Thermal Modelling; Electro-thermal coupling; Electro-thermal simulation; Thermal model extraction; Multi-chip power modules;
Vers les modèles électrothermiques compacts
W.HABRA, P.TOUNSI, J.M.DORKEL
ISGE
Manifestation sans acte : GDR Intégration des Systèmes de Puissance à 3 dimensions (ISP3D), Montpellier (France), 18-19 Octobre 2006, 4p. , N° 06777
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