6documents trouvés
Finite element based surface roughness study for ohmic contact of microswitches
H.LIU, D.LERAY, P.PONS, S.COLIN, A.BROUE
MINC, LGMT-INSAT, ICA, NOVAMEMS
Manifestation avec acte : IEEE Holm Conference on Electrical Contacts 2012 58 du 23 septembre au 26 septembre 2012, Portland (USA), 2012, pp.220-229 , N° 12397
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128457Impact of the surface roughness description on the electrical contact resistance of ohmic switches under low actuation forces
F.PENNEC, D.PEYROU, D.LERAY, P.PONS, R.PLANA, F.COURTADE
MINC, M2D, CNES
Revue Scientifique : IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol.2, N°1, pp.85-94, Janvier 2012 , N° 12044
Lien : http://hal.archives-ouvertes.fr/hal-00670045
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Abstract
At the present time, the insertion of radio frequency microelectromechanical switches into real architecture requires reduced actuation voltages, reduced dimensions, and better control of the electrical and electromechanical behavior that gives more importance to surface effects, their understanding, and modeling. The use of such devices requires the development of methods for estimating the contact performances as a function of surface roughness, contact materials, and contact topologies. With increase in computation capabilities, the rough surface topography can be implemented in the finite element model but implies long calculation times or even calculation overloading if a high definition of the roughness is desired. To reduce these limitations, assumptions on the microgeometry are required. This paper treats, by use of finite element modeling, the influence of the definition of roughness of contacting switch members on the electrical contact resistance of resistive switches, and investigates the error introduced by using a minimum defined atomic force microscope sampling interval of 10 nm. The present numerical analysis is implemented for switch test structures.
Validation of finite element structural simulation for ohmic microcontact
H.LIU, D.LERAY, P.PONS, S.COLIN, A.BROUE, J.MARTEGOUTTE, C.DIEPPEDALE
ICA, MINC, NOVAMEMS, CEA/LETI/MINATEC
Manifestation avec acte : Eurosensors XXV, Athènes (Grèce), 4-7 Septembre 2011, 4p. , N° 11858
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127797DC Contact Modeling of Electrostatically Actuated Switches with Low Voltage
F.PENNEC, D.PEYROU, D.LERAY, C.VILLENEUVE, A.COUSTOU, P.F.CALMON, P.PONS, R.PLANA, F.COURTADE
MINC, M2D, INSA-DGM, 2I, TEAM, CNES
Manifestation avec acte : 20th MicroMechanics Europe Workshop (MME 2009), Toulouse (France), 20-22 Septembre 2009, 4p. , N° 09693
Lien : http://hal.archives-ouvertes.fr/hal-00431019/fr/
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119522Multiphysics softwares benchmark on ANSIS/COMSOL applied for RF MEMS switches packaging simulations
D.PEYROU, P.PONS, H.GRANIER, D.LERAY, A.FERRAND, K.YACINE, M.SAADAOUI, A.NICOLAS, J.TAO, R.PLANA
M2D, TEAM, INSA-DGM, MEMSCAP, LEN7, MINC
Manifestation avec acte : 7th International Conference Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE'2006), Como (Italie), 24-26 Avril 2006, 8p. , N° 06102
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106810Mechanical characterization of silicon nitride thin films deposited on silicon wafers using nanoindentation techniques
K.YACINE, M.SAADAOUI, L.DANTAS, D.LERAY, M.SARTOR, H.ACHKAR, A.FERRAND, P.PONS, A.BOUKABACHE, D.DUBUC, K.GRENIER, R.PLANA, J.M.DESMARRES, F.PRESSECQ
TMN, EPSILON, INSA-DGM, CISHT, CNES, MINC
Manifestation avec acte : EUROSENSORS XVIII, Rome (Italie), 12-15 Septembre 2004, 4p. , N° 04767
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