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Abstract

This paper presents the design, fabrication and characterization of suspended solenoidal transformers fabricated using a low cost single step 3D copper electroplating process. The design and optimization of solenoidal transformers with and without magnetic core are performed using HFSS. After optimization, the suspended structures reveal good electrical performance. The addition of a magnetic core to these structures shows a significant improvement of its electrical properties. Thus, an increase of 10% on Gmax, 20% on coupling coefficient k, 80% on the quality factor Q and 350% on the inductance is observed. Under probe measurements carried on the suspended structures without magnetic core exhibit a Gmax of -1.45 dB and a Q of 28.5 at 2.5 GHz. The enhanced performance coupled with the low cost 3D process makes these transformers excellent candidates for today s RF applications.

Abstract

This work presents a new and low cost multi-level 3D copper interconnect process for RF and microwave applications. This process extends 3D interconnect integration technologies from silicon to above-IC polymer. Therefore, 3D passive devices and multi-level interconnects can be integrated using a single electroplating step making the process suitable for 3D-MMIC integration. 3D interconnects are realized by patterning the SU-8 to specific locations to create the desired 3D shape. A 3D seed layer is deposited above the SU-8 and the substrate to insure 3D electroplating current flow. The BPN is used as a thick mold for copper electroplating with an aspect ratio as high as 16:1. An optimized electroplating process is later used to grow copper in a 3D technique, insuring transition between all metallic layers. Finally, high-Q (60 @ 6 GHz) power inductors have been designed and integrated above a 50 W RF power LDMOS device, using this process.

Abstract

This paper presents a novel and efficient low cost process capable of integrating high-Q above-IC inductors and their interconnects using a single electroplating step. It relies on the SU8 and BPN resist as well as an optimized electroplating technique to form the 3D interconnected inductor. The SU8 is used to form a thick layer located underneath the inductor to elevate it from the substrate. Then, the BPN is used as a high resolution mold (16:1) for copper electroplating. Standard or time optimized electroplating is later used to grow copper in a 3D manner, making the transition between all metallic layers straight forward. High-Q (55 @ 5 GHz) power inductors have been designed and integrated above an RF power LDMOS device using this process. Finally, the process capabilities are demonstrated by integrating a solenoid inductor using only two lithography masks and a single electroplating step.

Abstract

Vibration harvesting has been intensively developed recently and systems have been simulated and realized, but real-life situations (including aircraft Structure Health Monitoring (SHM) involve uneven, low amplitude, low frequency vibrations. In such an unfavorable case, it is very likely that no power can be harvested for a long time. To overcome this, multi-source harvesting is a relevant solution, and in our application both solar and thermal gradient sources are available. We propose in this paper a complete Microsystem including a piezoelectric vibration harvesting module, thermoelectric conversion module, signal processing electronics and supercapacitor. A model is proposed for these elements and a VHDL-AMS simulation of the whole system is presented, showing that the vibration harvesting device alone cannot supply properly a SHM wireless node. Its role is nevertheless important since it is a more reliable source than thermoelectric generators (which depends on climatic conditions). Moreover, synergies between vibration harvesting and thermoelectric scavenging circuits are presented.

Mots-Clés / Keywords

SHM; Energy harversting; Scavenging; Piezoelectric; Thermoelectric; Supercapacitor; VHDL-AMS; Simulation; MEMS;

Mots-Clés / Keywords

Energy harversting; MEMS; FEM modeling; PZT;