Laboratoire d’Analyse et d’Architecture des Systèmes
P.MENINI, H.CHALABI, N.YOBOUE, V.CONEDERA, L.SALVAGNAC, K.AGUIR
M2D, TEAM, L2MP
Manifestation avec acte : Eurosensors XXII, Dresde (Allemagne), 7-10 Septembre 2008, 3p. , N° 08557
Diffusable
Plus d'informations
E.HAVARD, V.BARDINAL, Y.KIHN, T.CAMPS, A.ROCHER, L.SALVAGNAC, C.ARMAND, C.FONTAINE
PH, CEMES/CNRS, TEAM, INSAT
Manifestation avec acte : EXMATEC 2008, Lodz (Pologne), 1-4 Juin 2008, 2p. , N° 08225
Diffusable
114659M.AL AHMAD, L.SALVAGNAC, D.MICHAU, M.MAGLIONE, R.PLANA
MINC, TEAM, ICMCB-CNRS
Revue Scientifique : IEEE Microwave and Wireless Components Letters, Vol.18, N°6, pp.398-400, Juin 2008 , N° 08368
Diffusable
Plus d'informations
This letter reports for the first time the interesting behavior of the interface between indium tin oxide (ITO) as a high resistive electrode and barium strontium titanate tunable paraelectric thin film material. The interface is consisting of barium strontium titanate (BST) thin film dielectric material sandwiched between two ITO high resistive layers, all are integrated above glass substrate. When dc field is applied between the ITO layers, the BST thin film material properties are tuned. It is found that the ITO/BST/ITO heterostructure exhibits a tunable resistor performance. To our knowledge; these results are never reported.
L.JALABERT, P.DUBREUIL, F.CARCENAC, S.PINAUD, L.SALVAGNAC, H.GRANIER, C.FONTAINE
TEAM, PH
Revue Scientifique : Microelectronic Engineering, Vol.85, N°5-6, pp.1173-1178, Mai 2008 , N° 08182
Diffusable
Plus d'informations
We report an experimental study of GaAs etching by ICP-RIE based on Cl2:N2 chemistry. The influence of the RF source power, the chlorine dilution, the RF platen power, and the process pressure at several substrate temperatures are investigated. An optimized process is proposed to get routinely GaAs nanowires of 1 ¼m high and about 30 nm in diameter with a full top-down approach combining electron beam lithography and Ni lift-off steps.
K.GRENIER, C.BORDAS, S.PINAUD, L.SALVAGNAC, D.DUBUC
MINC, TEAM
Revue Scientifique : Microsystem Technologies, Vol.14, N°4-5, pp.601-606, Avril 2008 , N° 07601
Diffusable
Plus d'informations
This paper introduces the use of germanium as resistive material in RF MicroElectroMechanical (MEMS) devices. Integrated resistors are indeed highly required into RF MEMS components, in order to prevent any RF signal leakage in the bias lines and also to be compatible with ICs. Germanium material presents strong advantages compared to others. It is widely used in microtechnologies, notably as an important semi-conductor in SiGe transistors as well as sacrificial or structural layers and also mask layer in various processes (Si micromachining especially). But it also presents a very high resistivity value. This property is particularly interesting in the elaboration of integrated resistors for RF components, as it assures miniaturized resistors in total agreement with electromagnetic requirements. Its compatibility as resistive material in MEMS has been carried out. Its integration in an entire MEMS process has been fruitfully achieved and led to the successful demonstration and validation of integrated Ge resistors into serial RF MEMS variable capacitors or switches, without any RF perturbations.
E.HAVARD, T.CAMPS, V.BARDINAL, L.SALVAGNAC, C.ARMAND, C.FONTAINE, S.PINAUD
PH, N2IS, TEAM, INSAT
Revue Scientifique : Semiconductor Science and Technology, Vol.23, N°3, 035001p., Mars 2008 , N° 07748
Diffusable
Plus d'informations
The effects of thermal annealing on optically transparent electrodes of ITO (indium tin oxide) contact deposited on p-type Be-doped GaAs have been investigated by means of the transfer length method and secondary ion mass spectroscopy measurements. This study shows that the temperature that minimizes the specific contact resistance of ITO/GaAs (500 °C) greatly differs from the temperature that leads to a maximum conductivity of the ITO layer (600 °C) and from the values reported on ITO/GaAs in the literature. The oxygen diffusion in the semiconductor layer and its interaction with the beryllium dopant is pointed out to explain these differences.
K.ZHANG, C.ROSSI, D.ESTEVE, L.SALVAGNAC, V.CONEDERA, M.DILHAN
MIS, TEAM
Rapport LAAS N°08009, Janvier 2008, 50p.
Diffusion restreinte
112695H.CHALABI, K.A.NGO, K.AGUIR, P.MENINI, J.GUERIN, L.SALVAGNAC, E.SCHEID
M2D, L2MP, TEAM
Rapport LAAS N°07558, Octobre 2007, 2p.
Diffusable
111681L.JALABERT, P.DUBREUIL, F.CARCENAC, S.PINAUD, L.SALVAGNAC, O.GAUTHIER-LAFAYE, S.BONNEFONT
TEAM, PH
Manifestation avec acte : 33rd International Conference on Micro and Nano Engineering (MNE2007), Copenhague (Danemark), 23-26 Septembre 2007, 2p. , N° 07491
Diffusable
Plus d'informations
N.YOBOUE, P.MENINI, H.CHALABI, V.CONEDERA, L.SALVAGNAC, E.SCHEID
M2D, TEAM
Manifestation avec acte : 18th Workshop on MicroMechanics Europe (MME 2007), Guimaraes (Portugal), 16-18 Septembre 2007, pp.191-194 , N° 07526
Diffusable
Plus d'informations
The main goal of this work is to realize a metal oxide gas sensor with stable operating temperature. This article describes our approach and the technological process used to reach a high and stable operating temperature (650-700°C), with low consumption (100mW) and good thermal homogeneity all over the active area.