794documents trouvés
A multilevel polymer process for direct encapsulation of fluids in microfluidic systems
R.BOSSUYT, L.MAZENQ, V.CONEDERA, J.BALLET, A.M.GUE, J.P. CANO, H.CAMON
TEAM, Essilor Int, Tlse, N2IS
Revue Scientifique : Microsystems Technologies, Vol.18, N°2, pp.175-182, Janvier 2012 , N° 10648
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126327On chip magnetic actuator for batch-mode dynamic manipulation of magnetic particles in compact lab-on-chip
R.FULCRAND, A.BANCAUD, C.ESCRIBA, Q.HE, S.CHARLOT, A.BOUKABACHE, A.M.GUE
TEAM, N2IS
Revue Scientifique : Sensors and Actuators B: Chemical, Vol.160, N°1, pp.1520-1528, Décembre 2011 , N° 11573
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125625Micro-capteur pour la mesure en ligne et en continu de l'encrassement dans les procédés industriels et de traitement de l'eau
J.CRATTELET, L.FILLAUDEAU, L.AURET, L.SALVAGNAC, A.BOUKABACHE, D.ESTEVE
N2IS, LISBP, NEOSENS, TEAM
Rapport LAAS N°11617, Novembre 2011, 24p.
Diffusion restreinte
125829Capillary filling in nanochannels - Modeling, fabrication and experiments
V.N.PHAN, P.JOSEPH, L.DJEGHLAF, A.ALLOUCH, D.BOURRIER, P.ABGRALL, A.M.GUE, C. YANG, N-T. NGUYEN
NTU, Nanyang, N2IS, TEAM
Revue Scientifique : Heat Transfer Engineering, Vol.32, N°7-8, pp.624-635, Novembre 2011 , N° 10442
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125822Efficient prototyping of large-scale pdms and silicon nanofluidic devices using pdms-based phase-shift lithography
Y.VIERO, Q.HE, L.MAZENQ, H.RANCHON, J.Y.FOURNIOLS, A.BANCAUD
TEAM, N2IS
Rapport LAAS N°11616, DOI: 10.1007/s10404-011-0888-0, Novembre 2011, 13p.
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125827Collective micro-optics technologies for VCSEL photonic integration
V.BARDINAL, T.CAMPS, B.REIG, D.BARAT, E.DARAN, J.B.DOUCET
PH, N2IS, TEAM
Revue Scientifique : Advances in Optical Technologies, Vol.2011, N°paper ID 609643, 11p., Novembre 2011 , N° 11381
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126643Projet LUMELEC: mariage de l'optique et de l'électronique
P.ARGUEL, J.GRISOLIA, J.LAUNAY, H.TAP, C.DUPRAT, C.CAPELLO, F.GESSINN, F.GUERIN, C.ROUABHI
PH, TEAM, M2D, OSE, AIME
Manifestation avec acte : Colloque sur l'Enseignement des Technologies et des Sciences de l'Information et des Systèmes (CETSIS 2011), Trois Rivières (Canada), 23-26 Octobre 2011, 6p. , N° 11420
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126318Filière technologique des MEMS RF au LAAS
C.VILLENEUVE, P.PONS, S.AOUBA, P.F.CALMON
MINC, TEAM
Rapport LAAS N°11478, Septembre 2011, 27p.
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125279Flexible integration techniques for wireless sensors network deployment: application to aircraft structure health monitoring
D.DRAGOMIRESCU, M. M.JATLAOUI, S.CHARLOT, T.BELUCH, P.PONS, H.AUBERT, R.PLANA
TEAM, MINC
Manifestation avec acte : International Workshop on Structural Health Monitoring (IWSHM 2011), Stanford (USA), 13-15 Septembre 2011, pp.1519-1526 , N° 11453
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125299Efficient low cost process for single step metal forming of 3D interconnected above-IC inductors
A.GHANNAM, L.OURAK, D.BOURRIER, C.VIALLON, T.PARRA
MOST, TEAM
Manifestation avec acte : European Solid-State Device Research Conference (ESSDERC 2011), Helsinki (Finlande), 12-16 Septembre 2011, 4p. , N° 11522
Lien : http://hal.archives-ouvertes.fr/hal-00627894/fr/
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Abstract
This paper presents a novel and efficient low cost process capable of integrating high-Q above-IC inductors and their interconnects using a single electroplating step. It relies on the SU8 and BPN resist as well as an optimized electroplating technique to form the 3D interconnected inductor. The SU8 is used to form a thick layer located underneath the inductor to elevate it from the substrate. Then, the BPN is used as a high resolution mold (16:1) for copper electroplating. Standard or time optimized electroplating is later used to grow copper in a 3D manner, making the transition between all metallic layers straight forward. High-Q (55 @ 5 GHz) power inductors have been designed and integrated above an RF power LDMOS device using this process. Finally, the process capabilities are demonstrated by integrating a solenoid inductor using only two lithography masks and a single electroplating step.