Technical staff

• Monique DILHAN (IR - Area responsible)
• Samuel CHARLOT (IE)
• David COLIN (AI)

Assembly steps occur at the end of the manufacturing process. When the components must be tested or used individually. The typical "chain" of components assembly breaks down as follows:

•  mapping

• discretization (cutting)

• mounting on support (glue, solder, eutectic, flip chip, etc.) 

• Electricalc onnection (wire bonding, flip-chip, screen printing)

• Protection (encapsulation, sealing)

 You can also realize collective treatment of samples, such as the chemical mechanical polishing, thinning and substrates bonding such as thermocompression, Anodic bonding etc...

Equipments
Wire bonding 3 equipments
Eutectic 1 equipment
Pick and place 2 equipments
Flip chip 1 equipment
Grinder 1 equipment
Wafer bonder 2 equipments
Scribbing 2 equipments
Chemical machanical polishing 1 equipment
Dicing saw 1 equipment
Chemical mechanical polishing 1 equipment Screen printing 1 equipment

Know How
All stages of the Assembly process are achievable with for many of them  various techniques.  Cutting diamond saw (scribber) mounting (eutectic , manual report, semi automated, flip chip, choice of adhesives, etc.)  Electrical connection (Wedge, ball, Ribbon with different diameters of wires, screen printing) chemical mechanical thinning substrate bonding(Anodic, direct, eutectic)