• Véronique CONEDERA (IR - Area responsible)
• Laurent MAZENQ (AI)
• Adrian LABORDE (AI)
  

Photolithography is to reproduce an image on a coated substrate with a layer of photosensitive material (photoresist). This layer undergoes a chemical transformation under the effect of ultra violet radiation; the irradiated area will see its solubility increase or decrease depending on the type of resist (+ or-). This phase is the revelation. The part of the substrate stripped may then suffer various treatments: etching, deposition, settlements of ions...

Organization

The Photolithography area is composed of 32 equipment on an area of 90 m2 class 100. 

It includes 2 independent parties, a manual and an automated:

• Manual part within an HMDS oven, 3  Gyrset spin coaters and various annealing systems (ovens, hot plates), 3 masks aligners including 2 double-sided equipments dedicated to not exceeding 4 "diameter  substrates.

• Automatic part, within an HMDS oven, a system for coating and development of resists (EVG 120), a double-side mask aligner with automatic alignment (EVG 620), a semi automatic (Suss Microtec MA 150) mask aligner, dedicated to 4” and 6” diameter substrates.

Equipments

Resist benches Equiped with a total of 2 SUSS MICROTEC hot plates with ascent and descent ramp and 6 Micro Systems Ltd hot plates. .
	Spin coating 4 spin coaters; 3 Gyrset et 1 classicla
2 mask aligners MJB32 (right)
	1 mask aligner MA6
Ovens (on the left) 1  HMDS 2 drying 100°C et 200°C 1 with hygrometric control
Automated equipments
	Enduction/development tracks
EVG 620 Mask aligner
	MA 150 Mask aligner
Projection lithography Canon 3000i4
CO2 supercritical drying
Tousimis
	Separex

Know how

The main photosensitive materials used are: positive  Clariant (AZ 1505, AZ1529, AZ4562, ECL 3012),  Clariant lift off (AZ 5214); AZ N lof2035), Shipley (RPD 220) for thicknesses ranging from 0.5µm to 20µm.  Negative resists Microchem (SU8 3005, 3025, 3050, 2075) for thicknesses ranging from 1µm to 500µm;  A photosensitive polyimide Dow Chemical (BCB) for thicknesses of 2.5µm and µm. Negative SU8 - 10µm Negative SU8 - 25µm Negative SU8 - 50µm Negative SU8 - 100µm Negative SU8 - 500µm Positive AZ 4562 - 10µm Positive ECI 2.6µm Positive ECI 2cvc Lift off NLOF 5µm ECI 1.2µm for by lithoprojection AZ 40XT 20µm ECI 1.2µm + LOR 3A 350nm Stepper   Return top of page