Packaging

Technical staff

Assembly steps occur at the end of the manufacturing process. When the components must be tested or used individually. The typical "chain" of components assembly breaks down as follows:

  •  mapping
  • discretization (cutting)
  • mounting on support (glue, solder, eutectic, flip chip, etc.) 
  • Electricalc onnection (wire bonding, flip-chip, screen printing)
  • Protection (encapsulation, sealing)

 You can also realize collective treatment of samples, such as the chemical mechanical polishing, thinning and substrates bonding such as thermocompression, Anodic bonding etc...


Equipments



Wire bonding
3 equipments





Eutectic
1 equipment

Pick and place
2 equipments





Flip chip
1 equipment
FC150 Flip Chip
Grinder
1 equipment
Wafer bonder
2 equipments
Wafer Bonder AML
Scribbing
2 equipments


Chemical machanical polishing
1
equipment


Dicing saw
1
equipment


Chemical mechanical polishing
1
equipment




















Screen printing

1
equipment




Know How

All stages of the Assembly process are achievable with for many of them  various techniques. 

  • Cutting diamond saw (scribber)
  • mounting (eutectic , manual report, semi automated, flip chip, choice of adhesives, etc.) 
  • Electrical connection (Wedge, ball, Ribbon with different diameters of wires, screen printing)
  • chemical mechanical thinning
  • substrate bonding(Anodic, direct, eutectic)