Mask Fabrication


Laser Lithography area

The mask-making is compatible with fabrication of micro and nano devices. This area includes direct laser writing system and equipment for chemistry.


Equipments


DWL 200 Heidelberg


DWL200

HMP90





Resist benches




Know-how

MANUFACTURING of CHROMIUM MASKS and RETICLES

 The DWL 200 system is mainly dedicated to the manufacture of 5 inches square masks. These masks are used for optical lithography technology with 4 inches Silicon wafers.  The DWL 200 system is also sought for the manufacture of size 2.5 and 4 inch square masks. It is compatible to automated manufacture of 7 inches square mask and 6 inches square reticles.

ALIGNMENT and metrology

The DWL 200 system is equipped with an alignment device to write directly on the substrate. This method is useful for the completion of alignment with tolerance between 0.2 and 1 µm.   The DWL 200 system can also perform metrology such as measurement of distance between 1 µm and 200 mm with an accuracy ranging between 0.2 and 1 µm.   Metrology mode associated with the automatic alignment of the mask allows performing automated quality control  of finished masks.



• 3D MASKING

Finally an original method allows 3D submicron forms with AZ type resist (thickness less than 10 µm).

3D Photoresist

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